Leaf-type DIP!? Swelling and high-pressure jet combined lift-off device
Achieving swelling and high-pressure jet lift-off with high temperature, high peeling force, and low chemical consumption through a recycling-type circulation heater with a sheet-type design comparable to DIP!
Complete removal of stubborn resist that has become difficult to remove with a combination of a leaf-type device for DIP-level swelling and ultra-high pressure jet! ● Stubborn resist can be removed with repeated processing of swelling and high-pressure jet! - Resist that has become difficult to remove after high-temperature baking - Resist after dry etching - Resist deep within fine patterns Additionally, there is no issue with burrs or metal reattachment that can occur with DIP processing! This ultra-high pressure jet lift-off device is ideal for patterning thick films such as thick metal and oxide films that are difficult to etch. ● Compatible with thin wafers! We often hear concerns that high-pressure jets might break thin wafers (substrates). We have a track record of lift-off with GaAs at a thickness of 120um (pressure 3MPa). Pressure adjustments can be freely made depending on the device. 【Features】 ■ Swelling comparable to DIP! ■ Ultra-high pressure jet with MAX 20MPa ■ Repeated processing of swelling and ultra-high pressure jet possible! ■ Burr removal ■ No metal reattachment ■ Usable for cleaning resist, polymers, and masks Please consider a demo first!
- 企業：エイ・エス・エイ・ピイ
- 価格：Other
